sitemap Sitemap

SITEMAP

Marketplace SurplusGLOBAL
Equipment&Parts List
  • facebook
  • linkedin
  • wechat
  • youtube
  • Instagram

Manufacturer

default
default

Download All

[Remarketing] Hanmi Semiconductor FCB-A110 FCHIP ATTACH

Add to Watch
List
Remarketing
Event [AMKOR Remarketing 21-7] 83 units of Back-end Equipment
  • Code : K2011-1100745
  • Location : K4, Korea
Contact Info
SurplusGLOBAL USA, Inc. +1-408-436-5347 Email
Product Specialist
Joshua Hyun +82-31-728-1400 Email

Recommendations

disco-dfd6361-wafer-sawing

[SG87985]
Disco DFD6361 Wafer Sawing

Packaging
kaijo-fb700-wire-bonder

[SG24382]
Kaijo FB700 Wire Bonder

Packaging
asm-ad830-die-bonder

[SG66811]
ASM AD830 DIE BONDER

Packaging
musashi-awatron2-awmv310-mixer

[SG42304]
Musashi AWATRON2 AW-MV310 Mixer

Packaging
rudolph-nsx105-macro-inspection

[SG40396]
Rudolph NSX105 Macro Inspection

Metrology
amat-p5000-pteos

[SG71905]
AMAT P5000 PTEOS

CVD
semics-opus3-wafer-probing

[SG86925]
Semics OPUS3 Wafer Probing

ATE
advantest-m6771ad-pick-and-place-memory-handler

[SG71136]
Advantest M6771AD Pick and Place Memory Handler

ATE
ulvac-ceraus-zx1000-pvd

[SG15579]
Ulvac Ceraus ZX-1000 PVD

PVD
advantest-mce-8m-board-for-v93k-ate-etc

[SG71235]
Advantest MCE 8M Board for V93K ATE ETC

ATE
novellus-inova-pvd

[SG37920]
Novellus Inova PVD

PVD
hitachi-s5500-fesem

[SG62830]
Hitachi S-5500 FE-SEM

Metrology
tel-unity-me-85qd-oxide

[SG79168]
TEL Unity Me 85QD Oxide

Etch
amat-centura-40-radiance-rtp

[SG80741]
AMAT Centura 4.0 Radiance RTP

RTP
fei-tecnai-g2-f30-tem-electron-microscope

[SG73695]
FEI Tecnai G2 F30 TEM electron microscope

Metrology
veeco-dimension-x3d-afm

[SG41750]
Veeco Dimension X3D AFM

Metrology
asm-eagle12-cvd

[SG48729]
ASM Eagle12 CVD

CVD
screen-ws820l-batch-cleaning

[SG41680]
SCREEN WS-820L Batch Cleaning

WET
hitachi-is3200se-darkfield-inspection

[SG62218]
Hitachi IS3200SE Darkfield inspection

Metrology
amat-centura-ap-emax-ct-oxide

[SG81337]
AMAT Centura AP eMAX CT+ Oxide

Etch

Related Items

disco-dfd651-dicing-saw-pcb

[SG81229]
Disco DFD651 Dicing Saw (PCB)

Packaging
asm-ad830-die-bonder

[SG66811]
ASM AD830 DIE BONDER

Packaging
kaijo-fb700-wire-bonder

[SG24382]
Kaijo FB700 Wire Bonder

Packaging
default

[SG135686]
Disco DFG840 Grinder

Packaging
disco-dfd6361-wafer-sawing

[SG87985]
Disco DFD6361 Wafer Sawing

Packaging
asm-ad830-die-bonding

[SG81277]
ASM AD830+ Die bonding

Packaging
sussmicrotec-cbc200-wafer-bonder

[SG34049]
SUSSMicroTec CBC200 Wafer Bonder

Packaging
disco-dad640-dicing-saw-pcb

[SG81232]
Disco DAD640 Dicing Saw (PCB)

Packaging
sussmicrotec-cb200m-wafer-bonder

[SG34050]
SUSSMicroTec CB200M Wafer Bonder

Packaging
musashi-awatron2-awmv310-mixer

[SG42304]
Musashi AWATRON2 AW-MV310 Mixer

Packaging
opto-system-wds2200-led-chip-sorter

[SG58717]
OPTO SYSTEM WDS2200 LED Chip Sorter

Packaging
nitto-ma3000ii-backside-wafer-taper

[R127382]
Nitto MA3000II Backside Wafer Taper

Packaging
disco-dgp8761-wafer-production-equipment

[R148771]
Disco DGP8761 Wafer Production Equipment

Packaging
default

[R94979]
Fico AMSW40306 MOLD

Packaging
default

[R94961]
Disco DFL7160 LASER GROOVING

Packaging
default

[SG79787]
Sonix SONIX VISION SAT

Packaging
default

[R87503]
UNION DH-T5 MEASURING M/C

Packaging
default

[R67483]
APT VFS-60A OVEN

Packaging
default

[R94966]
ASM AD9212 K4 FC MLF C/AT+REFLOW+FL/C

Packaging
default

[R67488]
Protec Innovation DL++ UNDERFILL M/C

Packaging
Top

SurplusGLOBAL, Inc. | 56, Seochon-ro, Namsa-eup, Cheoin-gu, Yongin-si, Gyeonggi-do, 17118, Korea | Tel: +82-31-728-1400 Fax: +82-31-728-1401

Copyright (c) SurplusGLOBAL, Inc. all rights reserved

Please select the equipment category you would like to make inquires.
Front-end
Back-end
Etc
By using this site, you agree to our updated Privacy & Cookie Policy.
I Accept

Terms & Condition

View Full Article
Agree
Close

Terms & Condition

Confirm
Close

Hanmi Semiconductor FCB-A110 FCHIP ATTACH

Download All
Close

E-mail Inquiry

  • E-mail

  • Name

  • Company

  • Mobile

  • Description


Personal Information Collection and Usage Agreement

1. Purpose of collection and use of personal information - Identification and reply of e-mail inquiry
2. Collection Items: Name, Email, Contact
3. Retention and use period: 1 year
4. You have the right to deny this consent. If you disagree, you will not be able to register.

I agree to the purpose of collecting and using personal information.

Close