sitemap Sitemap

SITEMAP

Marketplace SurplusGLOBAL
Equipment&Parts List
  • facebook
  • linkedin
  • wechat
  • youtube
  • Instagram

Manufacturer

disco-dgp8761-wafer-production-equipment
disco-dgp8761-wafer-production-equipment
disco-dgp8761-wafer-production-equipment

Download All

[Remarketing] Disco DGP8761 Wafer Production Equipment

Add to Watch
List
Remarketing
Event [Remarketing for GLOBALFOUNDRIES] Bid for 240 units of Semiconductor Equipment
  • Code : BSG900
  • Location : Dresden, Saxony, Germany
Contact Info
SurplusGLOBAL USA, Inc. +1-408-436-5347 Email
Product Specialist
Joshua Hyun +82-31-728-1400 Email

Recommendations

disco-dfd651-dicing-saw-pcb

[SG81229]
Disco DFD651 Dicing Saw (PCB)

Packaging
novellus-c3-speed-next-hdp

[SG95248]
Novellus C3 Speed NeXT HDP

CVD
amat-centura-dxz-plasma-processing

[R150740]
AMAT Centura DxZ Plasma Processing

CVD
kla-edr5210-drsem

[SG28910]
KLA EDR5210 DRSEM

Metrology
tel-mark7-cotdev

[SG94100]
TEL Mark7 COT/DEV

Track
asm-eagle12-cvd

[SG48729]
ASM Eagle12 CVD

CVD
rudolph-nsx105-macro-inspection

[SG40396]
Rudolph NSX105 Macro Inspection

Metrology
tel-alpha808sc-plasma-processing-equipment-and-tools

[R150751]
TEL Alpha-808SC Plasma Processing Equipment and Tools

Furnace
accretech-uf200a-wafer-probing

[SG74174]
Accretech UF200A Wafer Probing

ATE
amat-centura-40-radiance-rtp

[SG80742]
AMAT Centura 4.0 Radiance RTP

RTP
fusion-m150pcu-uv-curing

[R24685]
Fusion M150PCU UV Curing

Asher
mattson-aspen-2-asher

[SG73718]
Mattson Aspen 2 Asher

Asher
advantest-t5377-wafer-tester

[SG81271]
Advantest T5377 Wafer Tester

ATE
ebara-epo222-wafer-production

[R150733]
EBARA EPO-222 Wafer Production

CMP
accretech-uf3000ex-wafer-probing-machine

[SG82503]
Accretech UF3000EX Wafer Probing Machine

ATE
tel-unity2e-855dd-plasma-processing-equipment-and-tools

[R150748]
TEL Unity2e 855DD Plasma Processing Equipment and Tools

Etch
hitachi-s5200-fesem

[SG28527]
Hitachi S-5200 FE-SEM

Metrology
tel-precio-probe

[R150859]
TEL Precio Probe

ATE
kla-ait-ii-defect-inspection-tool

[R138438]
KLA AIT II Defect Inspection Tool

Metrology
tel-mark8-cotdev

[SG93887]
TEL Mark8 COT/DEV

Track

Related Items

disco-dfd651-dicing-saw-pcb

[SG81229]
Disco DFD651 Dicing Saw (PCB)

Packaging
asm-ad830-die-bonder

[SG66811]
ASM AD830 DIE BONDER

Packaging
kaijo-fb700-wire-bonder

[SG24382]
Kaijo FB700 Wire Bonder

Packaging
default

[R155946]
Disco DFG840

Packaging
default

[B156250]Bid on Sale
Disco DFD6361

Packaging
asm-ad830-die-bonding

[SG81277]
ASM AD830+ Die bonding

Packaging
sussmicrotec-cbc200-wafer-bonder

[SG34049]
SUSSMicroTec CBC200 Wafer Bonder

Packaging
disco-dad640-dicing-saw-pcb

[SG81232]
Disco DAD640 Dicing Saw (PCB)

Packaging
sussmicrotec-cb200m-wafer-bonder

[SG34050]
SUSSMicroTec CB200M Wafer Bonder

Packaging
musashi-awatron2-awmv310-mixer

[SG42304]
Musashi AWATRON2 AW-MV310 Mixer

Packaging
nitto-ma3000ii-backside-wafer-taper

[R127382]
Nitto MA3000II Backside Wafer Taper

Packaging
opto-system-wds2200-led-chip-sorter

[SG58717]
OPTO SYSTEM WDS2200 LED Chip Sorter

Packaging
default

[R94961]
Disco DFL7160 LASER GROOVING

Packaging
default

[R94979]
Fico AMSW40306 MOLD

Packaging
default

[SG79787]
Sonix SONIX VISION SAT

Packaging
default

[B156300]Bid on Sale
TOWA YPS-2060

Packaging
default

[R87503]
UNION DH-T5 MEASURING M/C

Packaging
dage-4000-pxy-nordson-4000pxy-optic-stack-peel-test-machine

[R151919]
DAGE 4000 PXY Nordson 4000PXY - Optic Stack Peel Test Machine

Packaging
default

[R67483]
APT VFS-60A OVEN

Packaging
default

[R94966]
ASM AD9212 K4 FC MLF C/AT+REFLOW+FL/C

Packaging
Top

SurplusGLOBAL, Inc. | 56, Seochon-ro, Namsa-eup, Cheoin-gu, Yongin-si, Gyeonggi-do, 17118, Korea | Tel: +82-31-728-1400 Fax: +82-31-728-1401

Copyright (c) SurplusGLOBAL, Inc. all rights reserved

Please select the equipment category you would like to make inquires.
Front-end
Back-end
Etc
By using this site, you agree to our updated Privacy & Cookie Policy.
I Accept

Terms & Condition

View Full Article
Agree
Close

Terms & Condition

Confirm
Close

Disco DGP8761 Wafer Production Equipment

Download All
Close

E-mail Inquiry

  • E-mail

  • Name

  • Company

  • Mobile

  • Description


Personal Information Collection and Usage Agreement

1. Purpose of collection and use of personal information - Identification and reply of e-mail inquiry
2. Collection Items: Name, Email, Contact
3. Retention and use period: 1 year
4. You have the right to deny this consent. If you disagree, you will not be able to register.

I agree to the purpose of collecting and using personal information.

Close