sitemap Sitemap

SITEMAP

Marketplace SurplusGLOBAL
Equipment&Parts List
  • facebook
  • linkedin
  • wechat
  • youtube
  • Instagram

Manufacturer

asm-ad830-die-bonder
asm-ad830-die-bonder
asm-ad830-die-bonder

Download All

[In stock] ASM AD830 DIE BONDER

Add to Watch
List
For Sale
Contact Info
SurplusGLOBAL USA, Inc. +1-408-436-5347 Email
Product Specialist
Joshua Hyun +82-31-728-1400 Email

Recommendations

asm-ad830-die-bonding

[SG81277]
ASM AD830+ Die bonding

Packaging
sussmicrotec-cbc200-wafer-bonder

[SG34049]
SUSSMicroTec CBC200 Wafer Bonder

Packaging
disco-dfd651-dicing-saw-pcb

[SG81229]
Disco DFD651 Dicing Saw (PCB)

Packaging
sussmicrotec-cb200m-wafer-bonder

[SG34050]
SUSSMicroTec CB200M Wafer Bonder

Packaging
kaijo-fb700-wire-bonder

[SG24382]
Kaijo FB700 Wire Bonder

Packaging
asm-eagle12-cvd

[SG48729]
ASM Eagle12 CVD

CVD
teradyne-ip750-tester

[SG59219]
Teradyne IP750 Tester

ATE
nikon-optiphot-66-microscope

[SG18518]
Nikon OPTIPHOT 66 Microscope

Others
nikon-nsr2205i11d-iline-stepper

[SG94480]
Nikon NSR-2205i11D i-Line Stepper

Stepper
olympus-mx61lf-microscope

[SG80855]
Olympus MX61L-F Microscope

Others
kla-kla2138-brightfield-inspection

[SG73720]
KLA KLA2138 Brightfield Inspection

Metrology
hitachi-s9220-cdsem

[SG152386]
Hitachi S-9220 CD-SEM

Metrology
accretech-uf3000ex-wafer-probing-machine

[SG82503]
Accretech UF3000EX Wafer Probing Machine

ATE
mattson-ast3000-rtp

[SG37791]
Mattson AST3000 RTP

RTP
amat-centura-ap-isprint-via-w

[SG59436]
AMAT Centura AP ISPRINT VIA W

CVD
mattson-ast2800-rtp

[R96758]
Mattson AST2800 RTP

RTP
advantest-m6771ad-pick-and-place-memory-handler

[SG71136]
Advantest M6771AD Pick and Place Memory Handler

ATE
nikon-nsrsf130-iline-stepper

[SG95143]
Nikon NSR-SF130 I-Line Stepper

Stepper
amat-producer-se-peteos

[SG94559]
AMAT Producer SE PETEOS

CVD
nikon-nes1h04-20um-hline-mini-stepper

[SG36626]
Nikon NES1-H04 2.0um, h-line Mini Stepper

Stepper

Related Items

disco-dfd651-dicing-saw-pcb

[SG81229]
Disco DFD651 Dicing Saw (PCB)

Packaging
kaijo-fb700-wire-bonder

[SG24382]
Kaijo FB700 Wire Bonder

Packaging
default

[R155946]
Disco DFG840

Packaging
default

[B156250]Bid on Sale
Disco DFD6361

Packaging
asm-ad830-die-bonding

[SG81277]
ASM AD830+ Die bonding

Packaging
sussmicrotec-cbc200-wafer-bonder

[SG34049]
SUSSMicroTec CBC200 Wafer Bonder

Packaging
disco-dad640-dicing-saw-pcb

[SG81232]
Disco DAD640 Dicing Saw (PCB)

Packaging
sussmicrotec-cb200m-wafer-bonder

[SG34050]
SUSSMicroTec CB200M Wafer Bonder

Packaging
musashi-awatron2-awmv310-mixer

[SG42304]
Musashi AWATRON2 AW-MV310 Mixer

Packaging
nitto-ma3000ii-backside-wafer-taper

[R127382]
Nitto MA3000II Backside Wafer Taper

Packaging
opto-system-wds2200-led-chip-sorter

[SG58717]
OPTO SYSTEM WDS2200 LED Chip Sorter

Packaging
disco-dgp8761-wafer-production-equipment

[R148771]
Disco DGP8761 Wafer Production Equipment

Packaging
default

[R94961]
Disco DFL7160 LASER GROOVING

Packaging
default

[R94979]
Fico AMSW40306 MOLD

Packaging
default

[SG79787]
Sonix SONIX VISION SAT

Packaging
default

[B156300]Bid on Sale
TOWA YPS-2060

Packaging
default

[R87503]
UNION DH-T5 MEASURING M/C

Packaging
dage-4000-pxy-nordson-4000pxy-optic-stack-peel-test-machine

[R151919]
DAGE 4000 PXY Nordson 4000PXY - Optic Stack Peel Test Machine

Packaging
default

[R67483]
APT VFS-60A OVEN

Packaging
default

[R94966]
ASM AD9212 K4 FC MLF C/AT+REFLOW+FL/C

Packaging
Top

SurplusGLOBAL, Inc. | 56, Seochon-ro, Namsa-eup, Cheoin-gu, Yongin-si, Gyeonggi-do, 17118, Korea | Tel: +82-31-728-1400 Fax: +82-31-728-1401

Copyright (c) SurplusGLOBAL, Inc. all rights reserved

Please select the equipment category you would like to make inquires.
Front-end
Back-end
Etc
By using this site, you agree to our updated Privacy & Cookie Policy.
I Accept

Terms & Condition

View Full Article
Agree
Close

Terms & Condition

Confirm
Close

ASM AD830 DIE BONDER

Download All
Close

E-mail Inquiry

  • E-mail

  • Name

  • Company

  • Mobile

  • Description


Personal Information Collection and Usage Agreement

1. Purpose of collection and use of personal information - Identification and reply of e-mail inquiry
2. Collection Items: Name, Email, Contact
3. Retention and use period: 1 year
4. You have the right to deny this consent. If you disagree, you will not be able to register.

I agree to the purpose of collecting and using personal information.

Close